发明名称 SIDEWALL SPACERS ALONG CONDUCTIVE LINES
摘要 <p>Systems, methods and apparatus are provided for electromechanical systems devices having a sidewall spacer along at least one sidewall of a conductive line. An electromechanical systems device can include a sidewall spacer along at least one sidewall of a conductive line under a movable layer. The sidewall spacer can be sloped such that the sidewall spacer has a decreasing width away from a substrate under the movable layer. The conductive line can be configured to route an electrical signal to the electromechanical systems device. In some implementations, a black mask structure of an electromechanical systems device can include the conductive line.</p>
申请公布号 WO2013066625(A1) 申请公布日期 2013.05.10
申请号 WO2012US60642 申请日期 2012.10.17
申请人 QUALCOMM MEMS TECHNOLOGIES, INC. 发明人 HO, CHOK WAH;ZHONG, FAN
分类号 B81B3/00;G02B6/00 主分类号 B81B3/00
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