| 摘要 |
Above a prescribed mounting surface on the surface (22A) of a flexible wiring substrate (22), a press plate (28) for a flexible wiring substrate is provided at a position right below a first heat dissipation block (24) and a press sheet (26) in order to press the mounting surface toward a bottom cover (12). The press plate (28) for a flexible wiring substrate (28) has five protrusions (28PA, 28PB) that are aligned with each other. Respective protrusions (28PA, 28PB) are formed so as to intersect with an electroconductive pattern (22ACP) at a prescribed interval. |
