发明名称 Verfahren zum Anlegieren einer Dotierungspille an eine Halbleiterplatte
摘要 958,537. Semi-conductor devices. SONY CORPORATION. Oct. 20, 1961 [Oct. 31, 1960], No. 37777/61. Heading H1K. In a process in which an impurity is alloyed to a semi-conductor body, to form for example a tunnel diode, heating is provided by supplying a hot inert gas to the materials and then cooling them by means of a gas supplied in place of the hot gas. This enables quick heating and cooling to be provided. In the Figure, a germanium or silicon body 1a with an indium or aluminium dot 1b lies on a thin heat-conducting plate 3. Heater 5 enables a supply of hot nitrogen to be directed on to plate 3 for 5 seconds or less to heat the body 1 up to 600‹ C., and it can be cooled in 3 seconds by a flow of gas which is supplied via cooling medium 7.
申请公布号 DE1177745(B) 申请公布日期 1964.09.10
申请号 DE1961S076499 申请日期 1961.10.31
申请人 SONY CORPORATION (SONY KABUSHIKIKAISHA) 发明人 KAWANA YOSHIYUKI;NAKAGAWA AKIHIKO
分类号 C23C2/36;H01L21/00;H01L21/24 主分类号 C23C2/36
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