EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR PREPARING SAME, COMPOSITION AND CURED MATERIAL COMPRISING SAME, AND USAGE THEREOF

摘要

The present invention relates to an epoxy compound having an alkoxysilyl group, a method for preparing same, a composition and cured material comprising same, and usage thereof. A composite comprising the epoxy compound exhibits superior heat-resistant characteristics, or more specifically, the composite has a low coefficient of thermal expansion (CFE) and a high glass transition temperature or is Tg-less, and/or a cured material comprising the epoxy compound exhibits flame retardant properties and obviates the need for a separate silane coupling agent. The present invention provides: an epoxy compound having an alkoxysilyl group having, in a core, at least one substituent group of the chemical formula S1, and at least two epoxy groups; a method for preparing the epoxy compound by means of allylation of a starting material, Claisen rearrangement, glycidylation, and alkoxysilylation; an epoxy composition comprising the epoxy compound; and cured material of the compound and usage thereof. The novel composite of a composition comprising the epoxy compound having an alkoxysilyl group enhances chemical bonding, within the epoxy compound, of the alkoxysilyl group and filler, and additionally enhances the chemical bonding efficiency during the formation of the epoxy composite, which is due to the chemical bonding between the alkoxysilyl groups of the epoxy compound having an alkoxysilyl group. Accordingly, the composite exhibits superior heat-resistant characteristics, that is, the composite has a low CTE and a high glass transition temperature or is Tg-less. Additionally, the cured material resulting from the composition comprising the epoxy composition exhibits superior flame-retardant characteristics.