RESIN COMPOSITION, AND RESIN SHEET, PREPREG, LAMINATE, METAL SUBSTRATE AND PRINTED CIRCUIT BOARD USING SAME

摘要

A resin composition comprising: a first filler having an average particle diameter (D50) of 1 nm to 500 nm corresponding to 50% cumulation from the smallest particle diameter side in a weight cumulative particle size distribution, and including alpha-alumina; a second filler having an average particle diameter (D50) of 1 mum to 100 mum corresponding to 50% cumulation from the smallest particle diameter side in a weight cumulative particle size distribution; and a thermosetting resin including a mesogenic group within each molecule.