MONOLITHIC PACKAGE FOR HOUSING MICROELECTROMECHANICAL SYSTEMS

摘要

A sensor package for a microelectromechanical system (MEMS) is provided. The sensor package comprises a slot for receiving a MEMS, a bonding area in, or adjacent to, the slot for bonding the MEMS to the package and at least one package electrode to engage an electrode pad on the MEMS. Each package electrode is in communication with a conductor pad for connecting the MEMS to an electronic device.