| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a metal base circuit board that manufactures a metal base circuit board, which includes an insulation layer formed by using liquid crystalline polyester and is excellent in heat resistance, adhesion strength between a conductor circuit and the insulation layer, and heat radiation performance, without conducting polymerization of the liquid crystalline polyester under an inactive gas atmosphere during forming the insulation layer. <P>SOLUTION: A manufacturing method of a metal base circuit board 1 where a conductor circuit 4 is provided on a metal base 2 through an insulation layer 3 includes: coating a conductive foil for forming the conductor circuit 4 with a liquid crystalline polyester liquid composition, which includes a solvent and liquid crystalline polyester, and removing the solvent to form the insulation layer 3; overlapping the metal base 2 on the insulation layer 3 to obtain a laminated body and heat-pressing the obtained laminated body under vacuum or under an inactive gas atmosphere thereby thermal compression bonding the insulation layer to the metal base. The flow beginning temperature of the liquid crystalline polyester is 300 to 340°C. <P>COPYRIGHT: (C)2013,JPO&INPIT |
