发明名称 |
COMPOSITE COPPER POWDER |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a material having high thermal conductivity and a high electrical insulating property. <P>SOLUTION: There are provided composite copper powders comprising composite copper particles containing silicon carbide fine particles in core particles made of copper. A thermal conductivity at a temperature of 25°C under 1 atmospheric pressure is ≥10W/mk and volume resistivity at a temperature of 25°C and 100f/kg is ≥1x10<SP POS="POST">5</SP>Ωcm. It is preferable that a part of the surface of the silicon carbide fine particles is exposed and embedded by the surface of the core particles in the composite copper powders. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013082981(A) |
申请公布日期 |
2013.05.09 |
申请号 |
JP20110225137 |
申请日期 |
2011.10.12 |
申请人 |
MITSUI MINING & SMELTING CO LTD |
发明人 |
SHIMIZU YOSHINORI;MINOWA HIKARI |
分类号 |
B22F1/00;C22C9/00;C22C32/00;H01L23/373;H05K7/20 |
主分类号 |
B22F1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|