发明名称 COMPOSITE COPPER POWDER
摘要 <P>PROBLEM TO BE SOLVED: To provide a material having high thermal conductivity and a high electrical insulating property. <P>SOLUTION: There are provided composite copper powders comprising composite copper particles containing silicon carbide fine particles in core particles made of copper. A thermal conductivity at a temperature of 25&deg;C under 1 atmospheric pressure is &ge;10W/mk and volume resistivity at a temperature of 25&deg;C and 100f/kg is &ge;1x10<SP POS="POST">5</SP>&Omega;cm. It is preferable that a part of the surface of the silicon carbide fine particles is exposed and embedded by the surface of the core particles in the composite copper powders. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013082981(A) 申请公布日期 2013.05.09
申请号 JP20110225137 申请日期 2011.10.12
申请人 MITSUI MINING & SMELTING CO LTD 发明人 SHIMIZU YOSHINORI;MINOWA HIKARI
分类号 B22F1/00;C22C9/00;C22C32/00;H01L23/373;H05K7/20 主分类号 B22F1/00
代理机构 代理人
主权项
地址