发明名称 DOUGH FOR COMPOUNDED BAKED CONFECTIONERY
摘要 <P>PROBLEM TO BE SOLVED: To provide dough for compounded baked confectionery to obtain a uniformly laminated baked confectionery having uniform thickness of a tasteful ingredient layer without intermingling a cake layer, and to provide a method for manufacturing compounded based confectionery capable of easily obtaining the compounded baked confectionery having the characteristics. <P>SOLUTION: The dough for compounded baked confectionery consisting of cake dough and thin plate like tasteful ingredient is used. The dough for compounded baked confectionery especially has a laminated structure in which the thin plate like tasteful ingredient is arranged on an upper surface of the cake dough, and the specific gravity of the tasteful ingredient is larger than that of the cake dough. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013081391(A) 申请公布日期 2013.05.09
申请号 JP20110221861 申请日期 2011.10.06
申请人 ADEKA CORP 发明人 FUNAKAWA NATSUKI
分类号 A21D8/02;A21D13/08 主分类号 A21D8/02
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