发明名称 WIRING BOARD AND MANUFACTURING METHOD OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring board which enables a spark test to be conducted even when an electronic component is incorporated into the wiring board, and to provide a manufacturing method of the wiring board. <P>SOLUTION: A wiring board 10 comprises: an electronic component 300 having a first electrode 300A and a second electrode 300B; a second insulation layer 207 formed above the first insulation layer 100 and the electronic component 300; a third conductor pattern 411 which are formed on the second insulation layer 207 and includes first wiring 411a electrically connecting with the first electrode 300A, second wiring 411b connecting with the second electrode 300B, and third wiring 411c disposed between wires of the first wiring 411a and the second wiring 411b; a first inspection pad connecting with the first wiring 411a, a second inspection pad connecting with the second wiring 411b, and a third inspection pad connecting with the third wiring 411c. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013084692(A) 申请公布日期 2013.05.09
申请号 JP20110222342 申请日期 2011.10.06
申请人 IBIDEN CO LTD 发明人 SUMIYA TSUTOMU;SAKAI SHUNSUKE;WAKAZONO YOSHIHIRO
分类号 H05K3/46 主分类号 H05K3/46
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