| 发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed circuit board and a method of manufacturing the same which are capable of forming a fine pitch and a solder ball which are taller than the prior art and increase design flexibility. <P>SOLUTION: A printed circuit board 100 comprises: a base substrate 110 having a connection pad 120; a solder resist layer 130 having a first opening on the connection pad 120; and a solder ball 160 formed in the first opening, where the solder ball 160 has a shape of a snowman. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013084917(A) |
申请公布日期 |
2013.05.09 |
| 申请号 |
JP20120183257 |
申请日期 |
2012.08.22 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
LI SANG YUNG;YUN KYON RO;YONG GUAN SEOB |
| 分类号 |
H05K3/34;H05K1/18 |
主分类号 |
H05K3/34 |
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