| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a material for a ceramic circuit board which hardly generates irregularities produced in a circuit pattern peripheral edge, and a manufacturing method thereof. <P>SOLUTION: The present invention provides a material for a ceramic circuit board used for forming a circuit substrate including a conductive part formed on a ceramic substrate. When forming a desired circuit pattern of the conductive part, an average thickness in a center part of a circuit pattern of an etching resist film after curing which has been applied with use of a printing mask is set to 30 μm to 60 μm, while a maximum thickness of a circuit pattern peripheral edge is thicker than the average thickness in the center part of the circuit pattern by 5 μm or more. <P>COPYRIGHT: (C)2013,JPO&INPIT |
