| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which offers a cured material resistant to heat and light, and provide a premold package formed by using the composition. <P>SOLUTION: The thermosetting resin composition includes the following components (A)-(E): (A) 100 pts.mass of an isocyanuric acid derivative having at least one epoxy group in one molecule, (B) 10-1,000 pts.mass of silicone resin having at least one epoxy group in one molecule, (C) an acid anhydride hardening agent whose quantity is determined by that [the total number of equivalents of the epoxy groups in the (A) component and (B) component/the number of equivalents of a calboxyl group in the (C) component] is 0.6-2.2, (D) 0.05-5 pts.mass of a hardening accelerator with respect to a total 100 pts.mass of the components (A), (B), and (C), and (E) 200-1,000 pts.mass of an inorganic filler with respect to a total 100 pts.mass of the components (A), (B), and (C). <P>COPYRIGHT: (C)2013,JPO&INPIT |
