| 摘要 |
<P>PROBLEM TO BE SOLVED: To stably provide an excellent removal rate of sticking substance and damage suppression performance, relating to a substrate processing technology in which, after an adhesive member is made to abut on a substrate surface on which a pattern is formed, the adhesive member is stripped off so that the sticking substance is removed from the substrate surface. <P>SOLUTION: Before performing pasting/stripping-off cleaning using an adhesive tape T to a surface Wf of a substrate W, a notch position of the substrate W is detected. And then the substrate W is rotated based on the orientation of a pattern at the time point of notch detection. A relative directional relationship between the orientation of pattern and stripping-off direction is optimized so that the orientation of pattern becomes parallel to stripping-off direction X. Then, a cleaning head 7 is moved in (-X) direction from a notch detection position P2, for performing pasting/stripping-off cleaning using the adhesive tape T. <P>COPYRIGHT: (C)2013,JPO&INPIT |
