发明名称 |
Device Including Two Power Semiconductor Chips and Manufacturing Thereof |
摘要 |
A device includes a first power semiconductor chip having a first face and a second face opposite to the first face with a first contact pad arranged on the first face. The first contact pad is an external contact pad. The device further includes a first contact clip attached to the second face of the first power semiconductor chip. A second power semiconductor chip is attached to the first contact clip, and a second contact clip is attached to the second power semiconductor chip.
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申请公布号 |
US2013113114(A1) |
申请公布日期 |
2013.05.09 |
申请号 |
US201113289667 |
申请日期 |
2011.11.04 |
申请人 |
HOSSEINI KHALIL;MENGEL MANFRED;MAHLER JOACHIM;KALZ FRANZ-PETER;INFINEON TECHNOLOGIES AG |
发明人 |
HOSSEINI KHALIL;MENGEL MANFRED;MAHLER JOACHIM;KALZ FRANZ-PETER |
分类号 |
H01L23/52;H01L21/60 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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