| 发明名称 |
PROBE CARD AND MANUFACTURING METHOD THEREOF |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a probe card and a manufacturing method thereof that may prevent an electrode pad bonded with a probe pin from being released from a probe substrate. <P>SOLUTION: The probe card may include: a ceramic substrate which has at least one pad groove formed on one face thereof, and an electrode pad formed to be embedded in the pad groove; and a probe pin bonded to the electrode pad. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013083620(A) |
申请公布日期 |
2013.05.09 |
| 申请号 |
JP20110285225 |
申请日期 |
2011.12.27 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
HON KI-PYO;CHOI YONG SEOK;MA WON-CHOL;LEE DAE HYEONG |
| 分类号 |
G01R1/073;H01L21/66 |
主分类号 |
G01R1/073 |
| 代理机构 |
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| 主权项 |
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