WIRING CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wiring circuit board which reduces influences of a lead part for plating on a waveform of an electric signal, and to provide a manufacturing method of the wiring circuit board.

SOLUTION: A base insulation layer 11 is formed on a suspension body part 10. A lead wire for plating S and a wiring pattern 20 are integrally formed on the base insulation layer 11. A cover insulation layer 13 is formed on the base insulation layer 11 so as to cover the lead wire for the plating S and the wiring pattern 20. Multiple openings 15 are formed at a portion of the cover insulation layer 13 on a region R1 of the base insulation layer 11. In this case, the effective dielectric constant εraround the multiple lead wires for the plating S becomes small.

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