发明名称 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
摘要 The present invention provides a semiconductor device structure and a method for manufacturing the same. The method comprises: providing a semiconductor substrate, forming a first insulating layer on the surface of the semiconductor substrate; forming a shallow trench isolation embedded in the first insulating layer and the semiconductor substrate; forming a stripe-type trench embedded in the first insulating layer and the semiconductor substrate; forming a channel region in the trench; forming a gate stack line on the channel region and source/drain regions on opposite sides of the channel region. Embodiments of the present invention are applicable to manufacture of semiconductor devices.
申请公布号 US2013113025(A1) 申请公布日期 2013.05.09
申请号 US201113131745 申请日期 2011.02.25
申请人 ZHONG HUICAI;LIANG QINGQING;INSTITUTE OF MICROLECTRONICS, CHINESSE ACADEMY OFSCIENCES 发明人 ZHONG HUICAI;LIANG QINGQING
分类号 H01L29/78;H01L29/66 主分类号 H01L29/78
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