| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently radiate heat from the upper surface side of a heat generation electronic device facing a substrate in a heat radiation structure of the heat generation electronic device which includes a first heat radiation member, the heat generation electronic device which is mounted on a mounting surface of the first heat radiation member, and a substrate disposed above the mounting surface and the heat generation electronic device so as to be spaced away from the mounting surface and the heat generation electronic device. <P>SOLUTION: In a heat radiation structure of a heat generation electronic device 2, a second heat radiation member 41 is fixed to an upper surface 21a of the heat generation electronic device 2 which faces a substrate 5. Further, the second heat radiation member 41 is mechanically connected with the substrate 5. Furthermore, the second heat radiation member 41 is composed of a body part 41 which makes a surface contact with the upper surface 21a of the heat generation electronic device 2 and connection protrusions 42 protruding from the body part 41 toward the substrate 5. The connection protrusions 42 are inserted into insertion holes for heat radiation 53 of the substrate 5. <P>COPYRIGHT: (C)2013,JPO&INPIT |
