| 摘要 |
A resin composition which can be formed into a film for use in molding a large diameter thin film wafer is provided. The composition comprises components (A) a silicone resin containing repeating units represented by the following formulae (1-1), (1-2), and (1-3) and having a weight average molecular weight as measured by GPC in terms of polystyrene of 3,000 to 500,000, wherein r, s, and t are independently a positive integer; the silicon atom at the terminal of the units constituting the repeating units represented by the formulae (1-1), (1-2), and (1-3) is bonded to the terminal carbon atom of the X1, X2, or X3 in the same or different unit; R1 is independently a monovalent hydrocarbon group containing 1 to 8 carbon atoms; X1, X2, and X3 are independently a divalent group; (B) a thermosetting resin; and (C) a filler.
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