| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat sink structure and a manufacturing method thereof. <P>SOLUTION: The heat sink structure has a main body 1 having a first plate body 11 and a second plate body 12, and the first and second plate bodies are overlaid on each other corresponding to each other to constitute a chamber 14 between them and form a common opening region 13. The chamber has a capillary structure 17, a support structure 16, and filled working fluid. The opening region is provided through the first and second plate bodies and the chamber. When a heat sink is arranged at a heat generation source on the substrate, other electronic components adjacent to it are arranged in the opening region, and therefore, the heat sink can be arranged without hindering the electronic components. <P>COPYRIGHT: (C)2013,JPO&INPIT |
