| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high sensitivity and excellent storage stability, giving a cured film excellent in reliability (particularly in chemical resistance) and having a wide exposure margin and development margin in producing a cured film. <P>SOLUTION: The photosensitive resin composition comprises: (A) a polymer component having (a1) a repeating unit derived from a monomer having a carboxyl group protected by an acid decomposable group and/or a repeating unit derived from a monomer having a phenolic hydroxyl group protected by an acid decomposable group, and (a2) a repeating unit having a crosslinking group, in the same polymer and/or in different polymers; (B) a compound containing an oxime sulfonate residue expressed by general formula (b1); and (C) a solvent. The composition contains, as the solvent, at least one kind of solvent having a boiling point of lower than 180°C and at least one kind of solvent having a boiling point of 180°C or higher, in a ratio of (total amount of solvents having a boiling point of lower than 180°C):(total amount of solvents having a boiling point of 180°C or higher) ranging from 99:1 to 50:50 in terms of mass. <P>COPYRIGHT: (C)2013,JPO&INPIT |
