| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame which makes wiring removed from coating, which results from falling of a lead when a semiconductor chip is mounted and resin-sealed, less likely to occur and has high density wiring. <P>SOLUTION: A lead frame has a die pad which is formed by etching conductor foil and has a mounting surface on which a semiconductor element is mounted and multiple leads. In the lead frame, the die pad and the leads are formed by processing the conductor foil through wet etching using an etchant that an inhibitor is added. The widths of the die pad and the leads on the opposite side of the mounting surface are smaller than the widths of the die pad and the leads on the mounting surface side. <P>COPYRIGHT: (C)2013,JPO&INPIT |
