| 发明名称 |
System and Method for In Situ Monitoring of Top Wafer Thickness in a Stack of Wafers |
| 摘要 |
A system for holding non-contact wafer probes over the surface of a wafer which includes a system for flushing the surface of the probe during grinding.
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| 申请公布号 |
US2013114090(A1) |
申请公布日期 |
2013.05.09 |
| 申请号 |
US201113291800 |
申请日期 |
2011.11.08 |
| 申请人 |
SCHRAUB FREDERIC ANTHONY;VOGTMANN MICHAEL R.;SMEDLEY BENJAMIN C.;STRASBAUGH |
发明人 |
SCHRAUB FREDERIC ANTHONY;VOGTMANN MICHAEL R.;SMEDLEY BENJAMIN C. |
| 分类号 |
G01B11/28 |
主分类号 |
G01B11/28 |
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代理人 |
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