| 发明名称 |
ADHESIVE COMPOSITION FOR MASKING TAPE OF MOLDED UNDERFILL PROCESS AND MASKING TAPE USING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive composition for a masking tape of a molded underfill process and to provide a masking tape using the adhesive composition. <P>SOLUTION: According to the invention, an adhesive composition for a masking tape of a molded underfill process and the masking tape using the adhesive composition solve the problems of an existing acryl mold resealing adhesive layer, such as adhesive residue remaining on a PCB surface and marks on the surface occurring with several kinds of sealing materials (EMC), by forming an improved acryl mold releasing adhesive layer. Forming the improved acryl mold releasing adhesive layer prevents the adhesive residue on the PCB surface to improve the process failure rate and solves the problem of marks on the surface which occur with several kinds of EMC thereby allowing the masking tape using the adhesive composition to be applicable to several kinds of sealing materials used in MUF process. The invention makes such advantages. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013084873(A) |
申请公布日期 |
2013.05.09 |
| 申请号 |
JP20120006652 |
申请日期 |
2012.01.17 |
| 申请人 |
TORAY ADVANCED MATERIALS KOREA INC |
发明人 |
KIM YOUNG SOO;MOON KI JEONG;JEON KYONG YEON |
| 分类号 |
H01L21/56;C09J7/02;C09J11/06;C09J133/00;C09J175/04;C09J175/16;C09J183/00;C09J183/07;H01L21/60 |
主分类号 |
H01L21/56 |
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