发明名称 PRESSURE-HEATING APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To suppress the occurrence of a failure caused by rapid transmission of heat from a pressure-heating member to a workpiece. <P>SOLUTION: A pressure-heating apparatus 200 includes: the first and second pressure-heating members 56, 52 which pressurize and heat the workpiece, for example a laminate 2, by sandwiching it from both sides; and a lesser heat conductive member 55. The lesser heat conductive member 55 is composed of a material having lower heat conductivity than that of the first pressure-heating member 56 and arranged between the first pressure-heating member 56 and the workpiece. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013081971(A) 申请公布日期 2013.05.09
申请号 JP20110222210 申请日期 2011.10.06
申请人 SUMITOMO BAKELITE CO LTD 发明人 MEURA TORU
分类号 B23K3/04;B23K1/00;B23K31/02;B23K101/40;H01L21/56;H01L21/60;H01L25/065;H01L25/07;H01L25/18;H05K3/32;H05K3/36 主分类号 B23K3/04
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