发明名称 CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a curable organopolysiloxane composition having an excellent material in thermal conductivity uniformly dispersed therein, and to provide its manufacturing method. <P>SOLUTION: The curable organopolysiloxane composition in a grease or paste form contains an organopolysiloxane (A) which has two or more alkenyl groups bonded to a silicon atom, in one molecule; an organohydrogenpolysiloxane (B) which has two or more hydrogen atoms bonded to a silicon atom, in one molecule; gallium or its alloy (C) having a melting point of 0-70&deg;C; a thermally conductive filler (D) having an average particle diameter of 0.1-100 &mu;m, a platinum-based catalyst (E); and a polysiloxane (G) expressed by general formula (1) (wherein, R<SP POS="POST">1</SP>is a monovalent hydrocarbon group, which may be same or different; R<SP POS="POST">2</SP>is an alkyl group, an alkoxyl group, an alkenyl group or an acyl group; a is an integer of 5-100, and b is an integer of 1-3). <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013082816(A) 申请公布日期 2013.05.09
申请号 JP20110223905 申请日期 2011.10.11
申请人 SHIN-ETSU CHEMICAL CO LTD 发明人 YAMADA KUNIHIRO;MATSUMOTO NOBUAKI;TSUJI KENICHI
分类号 C08L83/14;C08K3/08;C08K3/22;C08K5/5419;C08L83/05;H01L23/36;H01L23/373 主分类号 C08L83/14
代理机构 代理人
主权项
地址