| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component which reduces variations in distribution of heat, resulting from heat generated by an electronic component element, which is due to the arrangement of via hole electrodes in a substrate of the electronic component thereby stabilizing heat radiation effect. <P>SOLUTION: An electronic component according to this invention includes a substrate 12. Multiple mounting terminals 20 are formed on a first main surface 12a of the substrate 12. At least parts of the multiple mounting terminals 20 are electrically connected with each other by connection electrodes 24. An electronic component element 14, which connects with the mounting terminals 20 through bumps 22, is mounted on the first main surface 12a of the substrate 12. In the substrate 12, an internal ground terminal 32 and an external ground terminal 34 are respectively disposed in the substrate 12 and on a second main surface 12b of the substrate 12 so as to face and be spaced away from the mounting terminals 20 in the thickness direction of the substrate 12. The mounting terminals 20 and the internal ground terminal 32 are electrically connected with each other by first via hole electrodes 42. The number of the first via hole electrodes 42 is smaller than that of the mounting terminals 20. <P>COPYRIGHT: (C)2013,JPO&INPIT |
