发明名称 CONDUCTIVE PASTE AND METHOD FOR PRODUCING THE SAME, BASE MATERIAL WITH CONDUCTIVE FILM, AND METHOD FOR MANUFACTURING BASE MATERIAL WITH CONDUCTIVE FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a conductive paste capable of forming a conductive film low in volume resistivity and having excellent thermal cycle durability. <P>SOLUTION: A conductive paste contains: a copper particle (A); at least one kind of sugar (B) selected from the group consisting of aldose and ketohexose, which are monosaccharides, and polysaccharides in which carbon at the 1-position based on an IUPAC naming method is asymmetric carbon having a hydroxyl group; and a thermosetting resin (C). The conductive paste further contains an ester or amide (D) of organic acid having a pKa of 1-4. A conductive film can be formed by coating the conductive paste on a base material and then heating the conductive paste at a temperature below 150&deg;C to be hardened. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013084411(A) 申请公布日期 2013.05.09
申请号 JP20110222781 申请日期 2011.10.07
申请人 ASAHI GLASS CO LTD 发明人 SUWA KUMIKO;HIRAKOSO HIDEYUKI
分类号 H01B1/22;H01B1/00;H01B5/14;H01B13/00;H05K1/09 主分类号 H01B1/22
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