发明名称 |
CONDUCTIVE PASTE AND METHOD FOR PRODUCING THE SAME, BASE MATERIAL WITH CONDUCTIVE FILM, AND METHOD FOR MANUFACTURING BASE MATERIAL WITH CONDUCTIVE FILM |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conductive paste capable of forming a conductive film low in volume resistivity and having excellent thermal cycle durability. <P>SOLUTION: A conductive paste contains: a copper particle (A); at least one kind of sugar (B) selected from the group consisting of aldose and ketohexose, which are monosaccharides, and polysaccharides in which carbon at the 1-position based on an IUPAC naming method is asymmetric carbon having a hydroxyl group; and a thermosetting resin (C). The conductive paste further contains an ester or amide (D) of organic acid having a pKa of 1-4. A conductive film can be formed by coating the conductive paste on a base material and then heating the conductive paste at a temperature below 150°C to be hardened. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013084411(A) |
申请公布日期 |
2013.05.09 |
申请号 |
JP20110222781 |
申请日期 |
2011.10.07 |
申请人 |
ASAHI GLASS CO LTD |
发明人 |
SUWA KUMIKO;HIRAKOSO HIDEYUKI |
分类号 |
H01B1/22;H01B1/00;H01B5/14;H01B13/00;H05K1/09 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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