发明名称 |
SURFACE TREATMENT METHOD OF POLISHING PAD AND POLISHING METHOD OF WAFER USING THE SAME |
摘要 |
Provided is a surface treatment method of a polishing pad. The surface treatment method of the polishing pad includes locating a wafer on the polishing pad including a polishing material, supplying a polishing pad polishing material between the polishing pad and the wafer to expose the polishing material included in the polishing pad, and polishing the wafer using the exposed polishing material.
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申请公布号 |
US2013115859(A1) |
申请公布日期 |
2013.05.09 |
申请号 |
US201213669028 |
申请日期 |
2012.11.05 |
申请人 |
CHOI SE HUN;KIM KYEONG SOON;MUN YOUNG HEE |
发明人 |
CHOI SE HUN;KIM KYEONG SOON;MUN YOUNG HEE |
分类号 |
B24B37/04;B28D5/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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