发明名称 |
Apparatus and Methods for Molded Underfills in Flip Chip Packaging |
摘要 |
Methods and apparatus for a forming molded underfills. A method is disclosed including loading a flip chip substrate into a selected one of the upper mold chase and lower mold chase of a mold press at a first temperature; positioning a molded underfill material in the at least one of the upper and lower mold chases while maintaining the first temperature which is lower than a melting temperature of the molded underfill material; forming a sealed mold cavity and creating a vacuum in the mold cavity; raising the temperature of the molded underfill material to a second temperature greater than the melting point to cause the molded underfill material to flow over the flip chip substrate forming an underfill layer and forming an overmolded layer; and cooling the flip chip substrate to a third temperature substantially lower than the melting temperature of the molded underfill material. An apparatus is disclosed.
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申请公布号 |
US2013115735(A1) |
申请公布日期 |
2013.05.09 |
申请号 |
US201113289719 |
申请日期 |
2011.11.04 |
申请人 |
CHEN MENG-TSE;LIN HSIU-JEN;LIN CHUN-CHENG;LU WEN-HSIUNG;CHENG MING-DA;LIU CHUNG-SHI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHEN MENG-TSE;LIN HSIU-JEN;LIN CHUN-CHENG;LU WEN-HSIUNG;CHENG MING-DA;LIU CHUNG-SHI |
分类号 |
H01L21/98;B29C35/08 |
主分类号 |
H01L21/98 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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