发明名称 |
ETCHANT FOR TRANSPARENT CONDUCTIVE THIN FILM LAMINATE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an etchant which makes possible to solve the problem that a conventional etchant for a transparent conductive thin film or transparent conductive thin film laminate undercuts a conductive thin film or the like. <P>SOLUTION: The etchant comprises a sulfuric acid, a hydrogen peroxide and a nitrogen-containing compound. The etchant has a pH below 7.0 and is used for etching a transparent conductive thin film or transparent conductive thin film laminate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013084680(A) |
申请公布日期 |
2013.05.09 |
申请号 |
JP20110222136 |
申请日期 |
2011.10.06 |
申请人 |
NIPPON HYOMEN KAGAKU KK |
发明人 |
USUI SHIGETAKA;KATORI MITSUOMI;SATO TAKAAKI |
分类号 |
H01L21/306;B32B9/00;B32B15/01;H01B13/00 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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