| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for cleaning a substrate, capable of preventing a water mark from remaining on a silicon surface, and contributing to space saving of the cleaning apparatus. <P>SOLUTION: A method for cleaning a substrate includes: conveying a wafer to a hydrofluoric acid tank 4 and subjecting the wafer to wet etching using an HF solution in the hydrofluoric acid tank 4 to expose a silicon surface of the wafer; conveying the wafer to a pure water rinse tank 5 to rinse the wafer in the pure water rinse tank 5; conveying the wafer to a drying device 6 to dry the wafer in the drying device 6; after the etching using the HF solution and the rinsing and the drying of the wafer, conveying the wafer to an alkaline tank 2 to subject the wafer to alkaline cleaning in the alkaline tank 2 to form a thin chemical oxide film on the silicon surface; and conveying the wafer to a pure water rinse tank 3 to rinse the wafer in the pure water rinse tank 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
