发明名称 PUNCHING APPARATUS AND PUNCHING METHOD USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a punching apparatus capable of preventing a punching chip in each through hole of a plurality of simultaneously formed through holes from remaining therein, improving the quality of each through hole, and extending the service life of a forming die, in the punching apparatus simultaneously forming the plurality of through holes in a base material. <P>SOLUTION: A punching apparatus 10 includes: a first forming die 11 having a plurality of pins 116 for punching; a second forming die 12 disposed opposite the first forming die 11 and having a plurality of holes 12a corresponding to the plurality of pins 116 in the first forming die 11; and a first vibration providing means 14 disposed in contact with the major surface of the first forming die 11 opposite the second forming die 12 and providing ultrasonic vibration to the first forming die 11 in a direction parallel to the movement direction of the first forming die 11. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013082038(A) 申请公布日期 2013.05.09
申请号 JP20110224554 申请日期 2011.10.12
申请人 ASAHI GLASS CO LTD 发明人 SUGANO AKIRA;MIKI HIROTAKA
分类号 B26D7/18;B26D7/08;B26F1/00 主分类号 B26D7/18
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