发明名称 |
Optoelectronic Component and Method for Producing an Optoelectronic Component |
摘要 |
An optoelectronic component comprising an optoelectronic semiconductor chip (104) having a contact side (106) and a radiation coupling-out side (108) situated opposite; a chip carrier (102), on which the semiconductor chip (104) is applied via its contact side (106); a radiation conversion element (110) applied on the radiation coupling-out side (108); and a reflective potting compound (112), which is applied on the chip carrier (102) and laterally encloses the semiconductor chip (104) and the radiation conversion element (110); wherein the potting compound (112) adjoins an upper edge of the radiation conversion element (110) in a substantially flush fashion, such that a top side of the radiation conversion element (110) is free of the potting compound (112).
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申请公布号 |
US2013113010(A1) |
申请公布日期 |
2013.05.09 |
申请号 |
US201113695606 |
申请日期 |
2011.04.11 |
申请人 |
BRUNNER HERBERT;GALLMEIER HANS-CHRISTOPH;JEREBIC SIMON;PREUSS STEPHAN;SCHOELL HANSJOERG;OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
BRUNNER HERBERT;GALLMEIER HANS-CHRISTOPH;JEREBIC SIMON;PREUSS STEPHAN;SCHOELL HANSJOERG |
分类号 |
H01L33/60;H01L33/00 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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