发明名称 MEASURING METHOD, DATA PROCESSING APPARATUS AND ELECTRON MICROSCOPE USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a measuring method that can determine pattern contours and dimensions with high precision even if an object to be measured shrinks due to electron beam radiations. <P>SOLUTION: A method, which performs measurements by radiating an electron beam onto a sample having a pattern formed on a primary coating thereof, prepares an SEM image and contour of the pattern (S201, S202), material parameters of the pattern part and primary coating part of the sample (S203, S204), and a beam condition in radiating the electron beam onto the sample (S205), and uses these prepared things to calculate a pattern shape or dimensions before the radiation of the electron beam (S206). <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013083466(A) 申请公布日期 2013.05.09
申请号 JP20110221682 申请日期 2011.10.06
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 OHASHI KENYOSHI;TANAKA JUNICHI;SEKIGUCHI TOMOKO;KAWADA HIROKI
分类号 G01B15/04;G01B15/00 主分类号 G01B15/04
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