摘要 |
A combination of an interconnect board and a module board for connecting a plurality of electronic modules to a processing unit is described. The interconnect board comprises a plurality of interconnect data lines connected between a plurality of interconnect board input terminals and interconnect board output terminals. The module board comprises at least one electronic module connected to a module connection input terminal, a plurality of module board data lines connected between a plurality of module board input terminals and a plurality of module board output terminals, and an unconnected module board output terminal. A first one of the interconnect board output terminals is connectable to the module connection input terminal, and the unconnected module board output terminal is connectable to one of the interconnect board input terminals.
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