SEMICONDUCTOR CHIP PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor chip package capable of removing or minimizing power noise generated in a voltage generation circuit in an integrated circuit chip.

SOLUTION: The semiconductor chip package includes: an integrated circuit chip including a voltage generation circuit for receiving external power source voltage to generate supply voltage to be used for an internal circuit and a connection terminal connected to an output node of the supply voltage of the voltage generation circuit; a noise remover electrically connected to the connection terminal to reduce power noise on the supply voltage; a loading substrate for loading the integrated circuit chip to package the integrated circuit chip as the semiconductor chip package.

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