发明名称 Pick And Bond Method For Attachment Of Adhesive Element To Substrate
摘要 A method for the attachment of a formed adhesive element (34,34') to a hot bonding part (10) in a practical and efficient way is disclosed. The formed adhesive element may be attached to the hot bonding part by the end-user prior to attachment of the hot bonding part to the substrate. In order to attach the formed adhesive element (34,34') to the bonding part according to the disclosed invention, the bonding part (10) is heated then is moved in position over the formed adhesive element positioned on a detent of a matrix plate (36). Thereafter the hot bonding part is moved into contact with the formed adhesive element or the formed adhesive element is moved against the hot bonding part. The bonding part, now having the formed adhesive element attached, is ready for attachment to the substrate. One or more formed adhesive elements may be attached to the bonding part. Attachment of the formed adhesive elements to the bonding part may be done manually or mechanically.
申请公布号 US2013112351(A1) 申请公布日期 2013.05.09
申请号 US201113695896 申请日期 2011.05.03
申请人 HANSEL MATHIAS;LAURE FREDERIC;DAVERIO OLIVIER;A. RAYMOND ET CIE 发明人 HANSEL MATHIAS;LAURE FREDERIC;DAVERIO OLIVIER
分类号 B29C65/02 主分类号 B29C65/02
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