| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring structure which allows electrode patterns to be connected to each other with a simple structure and ensures the strength of a wiring pattern even if the wiring structure is complicated, and to provide a useful method for manufacturing the wiring structure. <P>SOLUTION: A wiring structure of this invention has at least a first wiring pattern and a second wiring pattern which are formed on a substrate. The first wiring pattern is connected with the second wiring pattern by an aerial wiring portion formed by a metal wire. Further, metal plating, formed by a material that is the same with or different from the metal wire, is performed on at least a surface of the metal wire. <P>COPYRIGHT: (C)2013,JPO&INPIT |
