| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inexpensive and small resin sealing device with a simple constitution. <P>SOLUTION: A resin sealing device comprises at least an upper die 21 and a lower die 23, holds a substrate and a film between the upper die 21 and the lower die 23, and resin-seals electronic components mounted on the substrate with a resin material filled between the substrate and the film. The resin sealing device comprises: transfer means for transferring the lower die 23 to a molding position opposed to the upper die 21, a film supply position F positioned on one side of the upper die 21 and positioned immediately under a film supply unit 30 for supplying the film, and a substrate supply position E positioned on the other side of the upper die 21; and control means capable of transferring only the lower die 23 to the film supply position F and transferring the lower die 23 to the substrate supply position E while an intermediate die 22 is located on the lower die 23. <P>COPYRIGHT: (C)2013,JPO&INPIT |
