| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the bonding quality of wire bonding, while maintaining wear resistance of a thermal print head. <P>SOLUTION: First, a resistor layer 25 and an electrode layer 26 is formed in a predetermined pattern on the surface of the hot insulation layer 24 formed on the surface of a rectangular ceramic substrate 23 having a first long side 31 and a second long side 32 (first step). Next, whole surface protecting film layer 41 is formed (second step) and a positive resist layer 42 covering the whole surface protecting layer 41 is formed (third step). Next, a portion 43 becoming an electrode terminal is exposed (fourth step) and thereafter a negative resist layer 46 covering the positive resist layer 42 is formed (fifth step). Next, a region of a resistance heat generating part side of the negative resist layer 46 is exposed (sixth step), is developed (seventh step), is subjected to etching processing (eighth step), a remaining positive resist layer 42 is removed (ninth step). Thereby, the thermal print head in which steps are formed in the protective film layer can be manufactured. <P>COPYRIGHT: (C)2013,JPO&INPIT |
