| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce filling failures of an insulation member. <P>SOLUTION: On a surface of a support plate 44 where a projection part 43 is formed, a circuit board connection pad 31, a mounting pad 16, and a connector (an interlayer connector 32 and a wiring part 33) connecting between the circuit board connection pad 31 and the mounting pad 16 are formed by plating. The support plate 44 is arranged so as to be opposed to a circuit board 40 on which a semiconductor chip 14 is mounted, and the circuit board connection pad 31 is connected to an internal connection pad 19 via a bump 20. Resin is filled between the circuit board 40 and the support plate 44 to form an insulating layer 15. The support plate 44 is removed by etching. <P>COPYRIGHT: (C)2013,JPO&INPIT |
