| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder composition capable of sufficiently controlling solder balls during the reflow even when using a solder alloy of poor wettability and solder melting property. <P>SOLUTION: The solder composition contains lead-free solder powder having a melting point of ≤240°C, and flux containing rosin-type resin, activator, and thixotropic agent. The activator contains polycarboxylic acid expressed by general formula (1), where in the general formula (1), X denotes O, S, NH, N or P, m denotes an integer of 1-3, and n denotes 2 or 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
