| 摘要 |
<p>PURPOSE: A semiconductor package is provided to stably connect semiconductor chips by using a concave connection part and a convex connection part. CONSTITUTION: A first unit package(P1) includes one or more first chips(110). A part of the first chips include one or more first connection units(111,112). A second unit package(P2) includes one or more second chips(120). A part of the second chips include one or more second connection units(121,122). One of the first connection unit and the second connection unit is concave.</p> |
