FABRICATING METHOD FOR LIGHT EMITTING DEVICE PACKAGE

摘要

PURPOSE: A method for manufacturing a light emitting device is provided to prevent a body and a lead frame from being discolored by irradiating photodecomposition wavelength light to a substrate. CONSTITUTION: A light emitting device(200) is bonded to a substrate. Photodecomposition wavelength light(410) is irradiated to the substrate. The substrate includes a lead frame, a circuit board, or a package body. The photodecomposition wavelength light includes light emitted from a UV light emitting diode or a blue light emitting diode. The wavelength of the photodecomposition wavelength light is 360 to 475 nm.