Method for laser boring and component

摘要

Laser boring of a component (1) with a cavity (10), comprises introducing the component using a through-hole (19) via a wall (16) of the cavity, and filling the cavity at least in the region of the produced through-hole with Teflon(RTM: Polytetrafluoroethylene) powder. An independent claim is also included for a hollow component comprising Teflon(RTM: Polytetrafluoroethylene) powder in the cavity.