发明名称 |
Halbleiterpackung und Verfahren zur Herstellung derselben |
摘要 |
<p>A semiconductor package may include a substrate including a substrate connection terminal, at least one semiconductor chip stacked on the substrate and having a chip connection terminal, a first insulating layer covering at least portions of the substrate and the at least one semiconductor chip, and/or an interconnection penetrating the first insulating layer to connect the substrate connection terminal to the chip connection terminal. A semiconductor package may include stacked semiconductor chips, edge portions of the semiconductor chips constituting a stepped structure, and each of the semiconductor chips including a chip connection terminal; at least one insulating layer covering at least the edge portions of the semiconductor chips; and/or an interconnection penetrating the at least one insulating layer to connect to the chip connection terminal of each of the semiconductor chips.</p> |
申请公布号 |
DE102012212611(A8) |
申请公布日期 |
2013.05.08 |
申请号 |
DE201210212611 |
申请日期 |
2012.07.18 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, YOUNGLYONG;KIM, TAEHOON;JANG, CHULYONG;LEE, JONGHO |
分类号 |
H01L25/04;H01L21/52;H01L21/60;H01L23/48 |
主分类号 |
H01L25/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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