发明名称 |
ELECTRONIC DEVICES WITH YIELDING SUBSTRATES |
摘要 |
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts. |
申请公布号 |
EP2589082(A1) |
申请公布日期 |
2013.05.08 |
申请号 |
EP20110800038 |
申请日期 |
2011.06.29 |
申请人 |
COOLEDGE LIGHTING INC. |
发明人 |
TISCHLER, MICHAEL;SCHICK, PHILIPPE;ASHDOWN, IAN;SHEEN, CALVIN WADE;JUNGWIRTH, PAUL |
分类号 |
H05B37/00;F21K99/00;F21S2/00;H01L33/62;H05B37/04 |
主分类号 |
H05B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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