CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE WITH THE CIRCUIT BOARD

摘要

PURPOSE: A circuit board, a method for manufacturing a circuit board, and a semiconductor package with the circuit board are provided to improve the packing effect of a molding material by removing voids. CONSTITUTION: A base substrate(110) has a device mounting region. An electrical element is formed in the device mounting region. A resist pattern(120) covers a base substrate. The resist pattern exposes the device mounting region. A circuit pattern(114) is formed on an insulating layer(112).